Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Altmann B, Ahrens R, Welle A, Dinglreiter H, Schneider M, Schober A (2012) Microstructuring of multiwell plates for three-dimensional cell culture applications by ultrasonic embossing. Biomed Microdevice 14:291–301.
https://doi.org/10.1007/s1054401196058Y
2. Bronstein-Semendjajew (1960) Taschenbuch der Mathematik. Verlag Harri Deutsch, Leipzig. ISBN 3-87144-016-7
3. Chen Y (2015) Applications of nanoimprint lithography/hot embossing: a review. Appl Phys A 121:451–465.
https://doi.org/10.1007/s00339-015-9071-x
4. Erbrecht R, Felsch M, König H et al (2007) Das große Tafelwerk: interaktiv. Cornelsen Verlag, Berlin (1.Auflage 10.Druck). ISBN 978-3-464-57144-6
5. Giboz J, Copponnex T, Mélé P (2007) Microinjection molding of thermoplastic polymers: a review. J Micomech Microeng 17:R96–R109.
https://doi.org/10.1088/0960-1317/17/6/R02
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献