Author:
Wang Qibing,Yu Daquan,Jiang Feng,Liu Haiyan,Jing Xiangmeng
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Bolanos MA (2010) 3D packaging technology: enabling the next wave of application. In: Electronic manufacturing technology symposium, pp 1–5
2. Gabriel M, Bisson TKP, Sood S, Bair W, Hermanowski J (2010) Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration. In: 3D systems integration conference, pp 1–5
3. Garrou P, Bower C, Ramm P (2008) Handbook of 3D integration: technology and application of 3D integrated circuits, pp 1–11
4. Hermanowski J (2009) Thin wafer handling—study of temporary wafer bonding materials and processes. In: 3D system integration, pp 1–5
5. Justin WHST, Chai TC, Rao VS, David SWH, Fernandez DM, Siow LY, Lee WS, Serene MLT, Lee J (2010) Evaluation of support wafer system for thin wafer handling. In: Electronics packaging technology conference, pp 580–584
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