Solution chemical constraints in the chemical-mechanical polishing of copper: Aqueous stability diagrams for the Cu-H2O and Cu-NH3-H2O systems-Reference-Cited by-同舟云学术

Solution chemical constraints in the chemical-mechanical polishing of copper: Aqueous stability diagrams for the Cu-H2O and Cu-NH3-H2O systems

Published:1996-10 Issue:10 Volume:25 Page:1599-1607
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Osseo-Asake K.,Mishra Kamal K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02655582.pdf

Reference25 articles.

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3. J. Torres,Appl. Surf. Sci. 91, 112 (1995).

4. L.C. Parrillo,Advanced Metallization for ULSI Applications in 1994, eds. R. Blumenthal and G. Janssen, (Pittsburgh, PA: Mater. Res. Soc., 1995), p. 3.

5. C. Steinbrüchel,Appl. Surf. Sci. 91, 139 (1995).

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