The effects of descaling treatments on intermetallic formation and thermomechanical stability of an electroplated tin/lead layer in a semiconductor leadframe alloy-Reference-Cited by-同舟云学术

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The effects of descaling treatments on intermetallic formation and thermomechanical stability of an electroplated tin/lead layer in a semiconductor leadframe alloy

Published:1994 Issue:20 Volume:13 Page:1465-1468
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Chung T. Y.,Cho T. J.,Kim Y. G.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00419136.pdf

Reference11 articles.

1. T. b. massalski (editor), ?Binary alloy phase diagrams?, 2nd Edn (American Society for Metals International, Metals Park, Ohio) p. 1482.

2. K. N. Tu and R. D. Thomson, Acta Metall. 30 (1982) 947.

3. J. O. G. Parent, D. D. L. Chung and I. M. Bernstein, J. Mater. Sci. 23 (1988) 2564.

4. J. Hoyt, Brazing Soldering 13 (1987) 10.

5. D. S. Dunn, T. F. Marinis, W. M. Sherry and C. J. Williams, in ?Electronic packaging materials science?, edited by E. A. Geiss, K. N. Tu and D. R. Uhlman (Materials Research Society, Pittsburgh, Pennsylvania, 1985) p. 129.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of a coating on the springback of integrated circuit leadframes;Journal of Materials Processing Technology;2001-10

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