Author:
Lim Jae Hyuk,Han ManHee,Lee Jun-Youn,Earmme Youn Young,Lee Soon-bok,Im Seyoung
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference11 articles.
1. G. Stoney, The tension of metallic films deposited by electrolysis, Proc. R. Soc. London A 82 (1909) 172–175.
2. E. Suhir, Stresses in bi-metal thermostats, J. Appl. Mech. 53 (1986) 657–660.
3. E. Suhir, Approximate evaluation of the elastic interfacial stresses in the thin films with application to High-Tc superconducting ceramics, Int. J. Solids Struct. 27 (1991) 1025–1034.
4. J. S. Kim, K. W. Paik, J. H. Lim and Y. Y. Earmme, Thermomechanical stress analysis of laminated thick-film multilayer substrates, Appl. Phys. Lett. 74 (1999) 3507–3509.
5. J. S. Kim, B. K. Kim, J. H. Lim and K. W. Paik, The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates, J. Mat. Sci:Mat. Electr. 11 (2000) 45–56.
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