3D-printing and advanced manufacturing for electronics-Reference-Cited by-同舟云学术

3D-printing and advanced manufacturing for electronics

Published:2019-02-04 Issue:3 Volume:4 Page:245-267
ISSN:2363-9512
Container-title:Progress in Additive Manufacturing
language:en
Short-container-title:Prog Addit Manuf

Author:

Espera Alejandro H.^ORCID,Dizon John Ryan C.,Chen Qiyi,Advincula Rigoberto C.

Funder

PCIEERD-DOST

Honeywell-KCNSC

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering

Link

http://link.springer.com/article/10.1007/s40964-019-00077-7/fulltext.html

Reference109 articles.

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2. Research B (2017) “Global Electronics Components Market Sees Continued Growth (7.7% CAGR),” GlobeNewswire, 9 October 2017. https://globenewswire.com/news-release/2017/10/09/1142799/0/en/Global-Electronics-Components-Market-Sees-Continued-Growth-7-7-CAGR.html . Accessed 24 Oct 2018

3. Cook B, Tehrani B, Cooper J, Kim S, Tentzeris M (2015) Integrated printing for 2D/3D flexible organic electronic devices. Handbook of flexible organic electronics. Woodhead Publishing, Cambridge, pp 199–216

4. Weiderrecht G (2009) Handbook of nanofabrication. Elsevier, New York

5. Mosses R, Brackenridge S (2003) A novel process for the manufacturing of advanced interconnects. Circuit World 29(3):18–21

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