Electrical and Multiple Physics Simulation for Analog and Power WLCSP
Author:
Qu Shichun,Liu Yong
Publisher
Springer New York
Reference26 articles.
1. Liu, Y.: Power electronic packaging: Design, assembly process, reliability and modeling. Springer, Heidelberg (2012)
2. Sasagawa, K., Hasegawa, M., Saka, M., Abe, H.: Prediction of electromigration failure in passivated polycrystalline line. J. Appl. Phys. 91(11), 9005–9014 (2002)
3. Sukharev, V., Zschech, E.: A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength. J. Appl. Phys. 96(11), 6337–6343 (2004)
4. Tan, C.M., Hou, Y.J., Li, W.: Revisit to the finite element modeling of electromigration for narrow interconnects. J. Appl. Phys. 102(3), 1–7 (2007)
5. Tan, C.M., Roy, A.: Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects. Thin Solid Films 504(1–2), 288–293 (2006)