Author:
Cao Qiuling,Che Yanbo,Yang Jianxiong,Mi Menglai,Men Yaoyao
Funder
the National Key Research and Development Program of China
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Control and Systems Engineering
Reference37 articles.
1. Lu, B., Sharma, S. K.: A Literature Review of IGBT Fault Diagnostic and Protection Methods for Power Inverters, In: IEEE Transactions on Industry Applications, vol. 45, no. 5, pp. 1770–1777 (2009).
2. Wang, K., Zhou, L., Sun, P., Du, X.: Monitoring bond wires fatigue of multichip igbt module using time duration of the gate charge. IEEE Trans. Power Electron. 36(1), 888–897 (2021)
3. Hu, Z., Du, M., Wei, K.: Online calculation of the increase in thermal resistance caused by solder fatigue for IGBT modules. IEEE Trans. Device Mater. Reliab. 17(4), 785–794 (2017)
4. Han, J., Li, Y., Cao, Y., Ning, Z., Shen, Y., Xiong, J., Li, Y.: A new DC microgrid architecture based on MMC-SST and its control strategy [J]. Pow Syst Technol 2, 96–109 (2016). ((in Chinese))
5. Mainali, K., et al.: A transformerless intelligent power substation: a three-phase SST enabled by a 15-kV SiC IGBT. IEEE Power Electron Magaz 2(3), 31–43 (2015)
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