Author:
Sierra Suarez J. A.,Higgs C. F.
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference39 articles.
1. Liu, Y., Nassif, S.R., Pileggi, L.T., Strojwas, A.J.: Impact of interconnect variations on the clock skew of a gigahertz microprocessor. Paper presented at the Proceedings of the 37th Annual Design Automation Conference, Los Angeles, California, USA (2000)
2. Comes, R., Terrell, E., Higgs, C.: Pad deflection-based model of chemical-mechanical polishing for use in CAD IC layout. IEEE Trans. Semicond. Manuf. 23(1), 121–131 (2010)
3. Park, T., Tugbawa, T., Boning, D.S., Hymes, S., Brown, T., Smekalin, K., Schwartz, G.: Multi-level pattern effects in copper CMP. In: Proceedings of the CMP Symposium of the Electrochemical Society Meeting, pp. 94–100 (1999)
4. Shan, L., Levert, J., Meade, L., Tichy, J., Danyluk, S.: Interfacial fluid mechanics and pressure prediction in chemical mechanical polishing. J. Tribol. 122, 539 (2000)
5. He, L., Kahng, A.B., Tam, K.H., Xiong, J.: Design of integrated-circuit interconnects with accurate modeling of chemical-mechanical planarization. In: Proceedings SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, p. 109 (2005)
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献