Author:
Li Jing,Chai Zhimin,Liu Yuhong,Lu Xinchun
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
1. Murarka, S.P.: Multilevel interconnections for ULSI and GSI era. Mater. Sci. Eng. R 19(3–4), 87–151 (1997)
2. Rosenberg, R., Edelstein, D.C., Hu, C.K., Rodbell, K.P.: Copper metallization for high performance silicon technology. Annu. Rev. Mater. Sci. 30, 229–262 (2000)
3. Krishnan, M., Nalaskowski, J.W., Cook, L.M.: Chemical mechanical planarization: slurry chemistry, materials, and mechanisms. Chem. Rev. 110(1), 178–204 (2010)
4. Tripathi, S.: Tribo-chemical mechanisms of copper chemical mechanical planarization (CMP)—fundamental investigations and integrated modeling. ph.D. Thesis, University of California, Berkeley, Berkeley (2008)
5. Stojadinovic, J., Bouvet, D., Declercq, M., Mischler, S.: Effect of electrode potential on the tribocorrosion of tungsten. Tribol. Int. 42(4), 575–583 (2009)
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献