Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference47 articles.
1. Li, Y. (ed.): Microelectronic Applications of Chemical Mechanical Planarization. Wiley Interscience, New York (2008)
2. Gitis, N., Mudhivarthi, R.: Tribometrology of CMP process. In: Li, Y. (ed.) Microelectronic Applications of Chemical Mechanical Planarization, pp. 81–122. Wiley Interscience, New York (2008)
3. Liang, H.: Tribology in Chemical-Mechanical Planarization. CRC Press, Boca Raton (2005)
4. Tamai, K., Morinaga, H., Doi, T.K., Kurokawa, S., Ohnishi, O.: Analysis of chemical and mechanical factors in CMP processes for improving material removal rate. J. Electrochem. Soc. 158(3), H333 (2011)
5. Kim, H., Yang, J.C., Lee, J., Park, S.H., Won, J., Kim, M., Kim, T.: Frictional characteristic of polymeric additive for the slurry of chemical mechanical planarization process. ECS J. Solid State Sci. Technol. 1(3), P101–P106 (2012)
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