Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-008-3118-8.pdf
Reference22 articles.
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4. Vianco P, Hlava P, Kilgo A (1994) J Electron Mater 23:583
5. Vianco P, Kilgo A, Grant R (1995) J Electron Mater 24:1493
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