Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-013-7464-9.pdf
Reference40 articles.
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4. Colombo LPM, Petrushin A, Paleari D (2011) J Electron Packag 133:1
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