Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys-Reference-Cited by-同舟云学术

Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys

Published:2014-07-30 Issue:22 Volume:49 Page:7648-7658
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Atieh Anas M.,Khan Tahir I.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-014-8473-z.pdf

Reference42 articles.

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2. AlHazaa A, Khan TI, Haq I (2010) Transient liquid phase (TLP) bonding of Al7075 to Ti–6Al–4V alloy. Mater Charact 61:312–317

3. Elthalabawy W, Khan TI (2011) Liquid phase bonding of 316L stainless steel to AZ31 magnesium alloy. J Mater Sci Technol 27:22–28

4. Chang C-T, Shiue R-K (2006) Infrared brazing of Ti-6Al-4V using the Ti-15Cu-15Ni braze alloy. J Mater Sci 41:2145–2150. doi: 10.1007/s10853-006-5242-7

5. Jin YJ, Khan TI (2012) Effect of bonding time on microstructure and mechanical properties of transient liquid phase bonded magnesium AZ31 alloy. Mater Des 38:32–37. doi: 10.1016/j.matdes.2012.01.039

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