Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

Author:

Kadoguchi Takuya,Take Naoya,Yamanaka Kimihiro,Nagao Shijo,Suganuma Katsuaki

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference28 articles.

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3. Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging;Journal of Materials Science: Materials in Electronics;2021-07-16

4. Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding;Journal of Materials Research;2020-08-13

5. Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints;Journal of Materials Science: Materials in Electronics;2020-05-29

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