Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference56 articles.
1. Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mater Sci Eng 27:95–141. doi: 10.1016/S0927-796X(00)00010-3
2. McNulty JC (2008) Processing and Reliability Issues for Eutectic AuSn Solder Joints. In: 41st International Symposium on Microelectronics (IMAPS 2008) Proceedings, Providence, Rhode Island, USA, pp 909–916
3. Garnier A, Baillin X, Hodaj F (2013) Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging. J Mater Sci 24:5000–5013. doi: 10.1007/s10854-013-1515-5
4. Zeng G, McDonald S, Nogita K (2012) Development of high-temperature solders: review. Microelectron Reliab 52:1306–1322. doi: 10.1016/j.microrel.2012.02.018
5. Suganuma K, Kim S-J, Kim K-S (2009) High-temperature lead-free solders: properties and possibilities. JOM 61:64–71. doi: 10.1007/s11837-009-0013-y
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献