Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference34 articles.
1. Manikam VR, Cheong KY (2011) Die attach materials for high temperature applications: a review. IEEE Trans Compon Packag Manuf Technol 1:457–478
2. Möller E, Bajwa AA, Rastjagaev E, Wilde J (2014) Comparison of new die-attachment technologies for power electronic assemblies. In: IEEE Transactions on Electronic Components and Technology, pp 1707–1713
3. Khazaka R, Mendizabal L, Henry D, Hanna R (2015) Survey of high-temperature reliability of power electronics packaging components. IEEE Trans Power Electron 30:2456–2464
4. Yoon SW, Glover MD, Mantooth HA, Shiozaki K (2013) Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles. J Micromec Microeng 23:015–017
5. Yoon SW, Glover MD, Shiozaki K (2012) Nickel-tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles. IEEE Trans Power Electron 28:2448–2456
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献