Atomic force microscopy: a key to direct wafer bonding technology-Reference-Cited by-同舟云学术

Atomic force microscopy: a key to direct wafer bonding technology

Published:1995 Issue:2 Volume:14 Page:96-98
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Watt V. H. C.,Moinpour M.,Bower R.,Sundararaman R.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00456558.pdf

Reference13 articles.

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3. R. W. Bower, M. S. Ismail and S. N. Farrens, J. Elec. Mater. 20 (1991) 383.

4. R. w. bower and M. s. ismail, in Technical Digest in International Conference on Solid-State Sensors and Actuators, San Francisco, CA., June 1991, p. 312.

5. M. S. Ismail and R. W. Bower, J. Micromech. Microeng. 1 (1991) 231.

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