Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11665-008-9276-7.pdf
Reference17 articles.
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2. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, C.R. Kao, Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations, Mater. Sci. Eng. :A., 396, 2005, p. 385–391
3. J.W. Yoon, S.W. Kim, S.B. Jung, IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate, J. Alloys Comp., 392, 2005, p. 247–252
4. K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology, Mater. Sci. Eng. :R., 38, 2002, p. 55–105
5. J.H. Kim, S.W. Jeong, H.D. Kim, H.M. Lee, Morphological Transition of Interfacial Ni3Sn4 Grains at the Sn-3.5Ag/Ni Joint, J. Electron. Mater., 32(11), 2003, p.1228–1234
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1. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling;Materials Science and Engineering: A;2016-01
2. Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish;Journal of Electronic Materials;2014-10-15
3. Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection;Journal of Electronic Materials;2014-07-11
4. Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow;Intermetallics;2013-01
5. RESEARCH ON MICROSTRUCTURE OF Pb-FREE BGASOLDER JOINT ASSEMBLED WITH Sn-Pb SOLDERDURING ISOTHERMAL AGING;Acta Metallurgica Sinica;2013
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