Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish-Reference-Cited by-同舟云学术

Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish

Published:2014-10-15 Issue:12 Volume:43 Page:4485-4496
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Huang Z.,Kumar P.,Dutta I.,Sidhu R.,Renavikar M.,Mahajan R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-014-3441-6.pdf

Reference34 articles.

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2. P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar, and R. Mahajan, J. Electron. Mater. 41, 412 (2012).

3. Z. Huang, P. Kumar, I. Dutta, J.H.L. Pang, R. Sidhu, M. Renavikar, and R. Mahajan, J. Electron. Mater. 41, 375 (2012).

4. G. Humpston and D.M. Jacobson, Principles of Soldering and Brazing (Materials Park, OH: ASM International, 1993).

5. A. Sharif, M.N. Islam, and Y.C. Chan, Mater. Sci. Eng. B 113, 184 (2004).

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