Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11431-013-5245-y.pdf
Reference12 articles.
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4. Lin Y Y, Lo S P. Finite element modeling for chemical mechanical polishing process under different back pressures. J Mater Process Technol, 2003, 140: 646–652
5. Lo S P, Lin Y Y. The prediction of wafer surface non-uniformity using FEM and ANFIS in the chemical mechanical polishing process. J Mater Process Technol, 2005, 168: 250–257
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