Abstract
In this paper, for the purpose of increasing the wafer yield by controlling the non-uniformity of the material removal rate during the chemical mechanical polishing process, the influence of the cross-sectional shape of the metal-inserted retainer ring and the pressure distribution on the wafer and the retainer ring generated from the multi-zone carrier head are investigated. First, in order to verify the finite element analysis model, it is correlated using the test data. By using a validated finite element model, simulation studies involving several parameters are performed to reduce the irregularity in the wafer: (1) tapered bottom of the retainer ring, (2) machining round corners at the bottom of the retainer ring, (3) the changes in pressure applied to the wafer, (4) the changes in pressure applied to the retainer ring.
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
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