The prediction of wafer surface non-uniformity using FEM and ANFIS in the chemical mechanical polishing process-Reference-Cited by-同舟云学术

The prediction of wafer surface non-uniformity using FEM and ANFIS in the chemical mechanical polishing process

Published:2005-09 Issue:2 Volume:168 Page:250-257
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Lo Ship-Peng,Lin Yeou-Yih

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference15 articles.

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3. A two-dimensional process model for CMP planarization;Warnock;J. Electrochem. Soc.,1991

4. S. Sivaram, R. Tolles, H. Bath, E. Lee, R. Leggett. Chemical mechanical polishing of inter-level dielectrics: models for removal rate and planarity, Technical Report, SEMATECH, Austin, TX, 1992.

5. von Mises stress in chemical-mechanical polishing processes;Wang;J. Electrochem. Soc.,1997

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