Modeling of mechanical behavior of microcantilever due to intrinsic strain during deposition
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/BF02916268.pdf
Reference12 articles.
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2. Hsueh, C. -H., 2002, “Modeling of Elastic Deformation of Multilayers Due to Residual Stresses and External Bending,”Journal of Applied Physics, Vol. 91, pp. 9652–9656.
3. Hu, Y. Y. and Huang, W. M., 2004, “Elastic and Elastic-Plastic Analysis of Multilayer Thin Films: Closed-Form Solutions,”Journal of Applied Physics, Vol. 96, pp. 4154–4160.
4. Kiang, M. H., Solgaard, O., Muller, R. S. and Lau, K. Y., 1996, “Silicon-Micromachined Micromirrors with Integral High-Precision Actuators for External-Cavity Semiconductor Laser,”IEEE Photonics Technology Letters, Vol. 8, pp. 95–97.
5. Madou, M., 1993,Fundamentals of Microfabrication, Boca Raton: CRC Press, LLC.
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2. Prediction of pull-in phenomena and structural stability analysis of an electrostatically actuated microswitch;Acta Mechanica;2016-05-17
3. Analysis of fluid-structure interaction for predicting resonant frequencies and quality factors of a microcantilever on a squeeze-film;Journal of Mechanical Science and Technology;2011-12
4. Intrinsic stress, mismatch strain, and self-assembly during deposition of thin films subjected to an externally applied force;Journal of Mechanical Science and Technology;2008-11
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