Fracture analysis of electronic ic package in reflow soldering process
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF02996101.pdf
Reference23 articles.
1. Adachi, M., Ohuchi, S. and Totsuka, N., 1993, “New Mode Crack of LSI Package in the Solder Reflow Process,”IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 16, pp. 550–554.
2. Barsoum, R. S., 1976, “On the Use of Isoparametric Finite Element in Linear Fracture Mechanics,”International Journal for Numerical Methods in Engineering, Vol. 10, pp. 25–37.
3. Fukuzawa, I., lshiguro, S. and Nanbu, S., 1985, “Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering,”Proceeding on IEEE International Reliability Physics Symposium, pp. 192–197.
4. Glaser, J. C. and Juaire, M. P., 1989, “Thermal and Structural Analysis of a PLCC Device for Surface Mount Process,”ASME Transactions on Journal of Electronic Packaging, Vol. 111, pp. 172–178.
5. Hattori, T., Sakata, S. and Murakami, G., 1989, “A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices,”ASME Transactions on Journal of Electronic Packaging, Vol. 111, pp. 243–245.
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