1. Qin H, Zhao B, Nie X, Wen J, Yan Y (2013) 8th conference on industrial electronics and applications. Melbourne, Australia
2. Lu G-Q, Calata JN, Lei G, Chen X (2007) 2007 international conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems. London, UK
3. Neudeck PG, Okojie RS, Chen L-Y (2002) High-temperature electronics-a role for wide bandgap semiconductors. IEEE 90:1065–1076
4. Kisiel R, Szczepański Z, Firek P, Grochowski J, Myśliwiec M, Guziewicz M (2012) 35th international spring seminar on electronics technology. Bad Aussee, Austria
5. Chin HS, Cheong KY, Ismail AB (2010) A review on die attach materials for SiC-based high-temperature power devices. Metall Mater Trans B Process Metall Mater Process Sci 41:824–832