Effects of Dummy Thermal Vias on Interconnect Delay and Power Dissipation of Very Large Scale Integration Circuits

Author:

Xu Peng,Pan Zhongliang

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Reference21 articles.

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2. Sahoo S, Datta M, Kar R. An efficient dynamic power estimation method for on-chip VLSI interconnects [C]// International Conference on Emerging Applications of Information Technology. Piscataway: IEEE, 2011: 379–382.

3. Moiseev K, Wimer S, Kolodny A. Timing-constrained power minimization in VLSI circuits by simultaneous multilayer wire spacing [J]. Integration the VLSI Journal, 2015, 48(1): 116–128.

4. Frankel B, Wimer S. Optimal VLSI delay tuning by wire shielding [J]. Journal of Optimization Theory and Applications, 2016, 170(3): 1060–1067.

5. Kar R, Maheshwari V, Mondal S, et al. Bhattacharjee. A novel power estimation method for on-chip VLSI distributed RLCG global interconnects using model order reduction technique [C]// International Conference on Advances in Computer Engineering. Piscataway: IEEE, 2010: 105–109.

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