Mathematical modeling of material removal rate in roll-type linear CMP (roll-CMP) process: Effect of polishing pad
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s12541-016-0062-4.pdf
Reference25 articles.
1. Lee, H., Park, Y., Lee, S., and Jeong, H., “Preliminary Study on the Effect of Spray Slurry Nozzle in CMP for Environmental Sustainability, Int. J. Precis. Eng. Manuf., Vol. 15, No. 6, pp. 995–1000, 2014.
2. Lee, H., Guo, Y., and Jeong, H., “Temperature Distribution in Polishing Pad during CMP Process: Effect of Retaining Ring, Int. J. Precis. Eng. Manuf., Vol. 13, No. 1, pp. 25–31, 2012.
3. Lee, H., Dornfeld, D. A., and Jeong, H., “Mathematical Modelbased Evaluation Methodology for Environmental Burden of Chemical Mechanical Planarization Process, Int. J. Precis. Eng. Manuf.-Green Tech., Vol. 1, No. 1, pp. 11–15, 2014.
4. Wang, H., Lee, H., and Jeong, H., “Statistical Analysis on Process Variables in Linear Roll-CMP, Journal of the Korean Society of Tribologists and Lubrication Engineers, Vol. 30, No. 3, pp. 139–145, 2014.
5. Lee, H., Wang, H., Park, J., and Jeong, H., “Experimental Investigation of Process Parameters for Roll-Type Linear Chemical Mechanical Polishing (Roll-CMP) System, Precision Engineering, Vol. 38, No. 4, pp. 928–934, 2014.
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