Author:
Lee Hojun,Kim Moonsung,Jeong Haedo
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference20 articles.
1. Lee, C., Lee, H., Jeong, M., and Jeong, H., “A Study on the Correlation between Pad Property and Material Removal Rate in Cmp,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 5, pp. 917–920, 2011.
2. Steigerwald, J. M., Murarka, S. P., and Gutmann, R. J., “Chemical Mechanical Planarization of Microelectronic Materials,” Wiley, pp. 7–12, 1997.
3. Cook, L. M., “Chemical Processes in Glass Polishing,” Journal of Non-Crystalline Solids, Vol. 120, No. 1, pp. 152–171, 1990.
4. Tomozawa, M., “Oxide CMP Mechanisms,” Solid State Technology, Vol. 40, No. 7, pp. 169–175, 1997.
5. Nogami, M. and Tomozawa, M., “Effect of Stress on Water Diffusion in Silica Glass,” Journal of the American Ceramic Society, Vol. 67, No. 2, pp. 151–154, 1984.
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