Quantitative analysis on air-dispensing parameters for manufacturing dome lenses of chip-on-board LED system-Reference-Cited by-同舟云学术

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Quantitative analysis on air-dispensing parameters for manufacturing dome lenses of chip-on-board LED system

Published:2014-11 Issue:11 Volume:15 Page:2437-2441
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Jeon Eun-chae,Lee Je-Ryung,Je Tae-Jin,Choi Doo-Sun,Ham Young-Bog,Lee Eung-Sug,Choi Sang-Kyu,Kim Hwi

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s12541-014-0611-7.pdf

Reference13 articles.

1. Lawton, W. and Barrett, J., “Characterisation of Chip-on-Board and Flip Chip Packaging Technologies by Acoustic Microscopy,” Microelectronics Reliability, Vol. 36, No. 11, pp. 1803–1806, 1996.

2. Wang, Z. P., Tan, Y. M., and Chua, K. M., “Board Level Reliability Assessment of Chip Scale Packages,” Microelectronics Reliability, Vol. 39, No. 9, pp. 1351–1356, 1999.

3. Morrow, R. C., “Led Lighting in Horticulture,” HortScience, Vol. 43, No. 7, pp. 1947–1950, 2008.

4. Sim, J. K., Ashok, K., Ra, Y. H., Im, H. C., Baek, B. J., and Lee, C. R., “Characteristic Enhancement of White Led Lamp using Low Temperature Co-Fired Ceramic-Chip on Board Package,” Current Applied Physics, Vol. 12, No. 2, pp. 494–498, 2012.

5. Kückmann, O., “High-Power Led Arrays: Special Requirements on Packaging Technology,” Proc. of SPIE, Vol. 6134, Paper No. 613404, 2006.

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