Author:
Liu Wei,Calimera Andrea,Nannarelli Alberto,Macii Enrico,Poncino Massimo
Publisher
Springer Berlin Heidelberg
Reference10 articles.
1. Cheng, Y.K., Raha, P., Teng, C.C., Rosenbaum, E., Kang, S.M.: Thermal and power integrity based power/ground networks optimization. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 17(8), 668–681 (1998)
2. Wang, T.Y., Tsai, J.L., Chung-Ping Chen, C.: Thermal and power integrity based power/ground networks optimization, February 2004, vol. 2, pp. 830–835 (2004)
3. Chen, D., Li, E., Rosenbaum, E., Kang, S.M.: Interconnect thermal modeling for accurate simulation of circuit timing and reliability. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 19(2), 197–205 (2000)
4. Sabry, M.N., Bontemps, A., Aubert, V., Vahrmann, R.: Realistic and efficient simulation of electro-thermal effects in vlsi circuits. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5(3), 283–289 (1997)
5. Wunsche, S., Clauss, C., Schwarz, P., Winkler, F.: Electro-thermal circuit simulation using simulator coupling. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5(3), 277–282 (1997)
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献