Metallic Micro and Nano Materials
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-642-15411-9.pdf
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Thermal processes under explosive loading of amorphous alloy powders;MATEC Web of Conferences;2021
2. Electrical characteristics, stability, electromigration, Joule heating, and reliability aspect of focused ion beam fabricated gold and copper nanobar interconnects on SiO2 and glass substrates;Journal of Vacuum Science & Technology B;2020-11
3. Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging;Soldering & Surface Mount Technology;2018-02-05
4. Healing Effect of Controlled Anti-Electromigration on Conventional and High-T c Superconducting Nanowires;Small;2017-05-19
5. Tunable Ultra-high Aspect Ratio Nanorod Architectures grown on Porous Substrate via Electromigration;Scientific Reports;2016-02-29
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