Impact of Process Variations on Pulsed Flip-Flops: Yield Improving Circuit-Level Techniques and Comparative Analysis

Author:

Lanuzza Marco,De Rose Raffaele,Frustaci Fabio,Perri Stefania,Corsonello Pasquale

Publisher

Springer Berlin Heidelberg

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Impacts of Process Variations and Aging on Lifetime Reliability of Flip-Flops;Lifetime Reliability-aware Design of Integrated Circuits;2022-11-17

2. Impacts of Process Variations and Aging on Lifetime Reliability of Flip-Flops: A Comparative Analysis;IEEE Transactions on Device and Materials Reliability;2019-09

3. Reliability Enhancement of Low-Power Sequential Circuits Using Reconfigurable Pulsed Latches;IEEE Transactions on Circuits and Systems I: Regular Papers;2017-07

4. A variation-aware simulation framework for hybrid CMOS/spintronic circuits;2017 IEEE International Symposium on Circuits and Systems (ISCAS);2017-05

5. Variability-Aware Analysis of Hybrid MTJ/CMOS Circuits by a Micromagnetic-Based Simulation Framework;IEEE Transactions on Nanotechnology;2017-03

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