Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,General Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11771-016-3314-7.pdf
Reference19 articles.
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3. MEYER P, CLAVERLEY J D, LEACH R K. Quality control for deep X-ray lithography (LIGA): A preliminary metrology study [J]. Microsystem Technologies, 2012, 18(4): 415–421.
4. SHANA W L, YANG Y, HILLIE K T, JORDAAN W A, SOBOYEJO W O. Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films [J]. Materials Science & Engineering A, 2013, 561(3): 434–440.
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