An experimental study of PCM based finned and un-finned heat sinks for passive cooling of electronics-Reference-Cited by-同舟云学术

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An experimental study of PCM based finned and un-finned heat sinks for passive cooling of electronics

Published:2018-05-29 Issue:12 Volume:54 Page:3587-3598
ISSN:0947-7411
Container-title:Heat and Mass Transfer
language:en
Short-container-title:Heat Mass Transfer

Author:

Usman Hazrat,Ali Hafiz Muhammad,Arshad Adeel,Ashraf Muhammad Junaid,Khushnood Shahab,Janjua Muhammad Mansoor,Kazi S. N.

Funder

university of engineering and technology taxila

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Link

http://link.springer.com/article/10.1007/s00231-018-2389-0/fulltext.html

Reference39 articles.

1. Grimes R, Walsh E, Walsh P (2010) Active cooling of a mobile phone handset. Appl Therm Eng 30(16):2363–2369

2. Luo Z et al (2008) System thermal analysis for mobile phone. Appl Therm Eng 28(14–15):1889–1895

3. Arshad W, Ali HM (2017) Graphene nanoplatelets nanofluids thermal and hydrodynamic performance on integral fin heat sink. Int J Heat Mass Transf 107(Supplement C):995–1001

4. Ali HM, Arshad W (2017) Effect of channel angle of pin-fin heat sink on heat transfer performance using water based graphene nanoplatelets nanofluids. Int J Heat Mass Transf 106(Supplement C):465–472

5. Ali HM, Arshad W (2015) Thermal performance investigation of staggered and inline pin fin heat sinks using water based rutile and anatase TiO2 nanofluids. Energy Convers Manag 106:793–803

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