Investigation of enhanced PCM heat sink design under extreme thermal conditions for high-heat-generating electronic devices-Reference-Cited by-同舟云学术

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Investigation of enhanced PCM heat sink design under extreme thermal conditions for high-heat-generating electronic devices

Published:2024-12 Issue: Volume:159 Page:108050
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Lee Sangwook,Choi Hongseok,Park Piljun,Kang Sungwook,Choi Kyutae,Lee Hoseong

Funder

National Research Foundation of Korea

Ministry of Science, ICT and Future Planning

Publisher

Elsevier BV

Reference65 articles.

1. Heat transfer enhancement of phase-change materials (PCMs) based thermal management systems for electronic components: A review of recent advances;Afaynou;Int. Commun. Heat Mass Transf.,2023

2. A comparative study and optimization of phase change material based heat sinks for thermal management of electronic components;Kumar;J. Energy Storage,2021

3. Experimental and numerical optimization of cascaded PCM heat sink by using low melting point alloys;Huang;Energy Convers. Manag.,2022

4. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew. Sust. Energ. Rev.,2017

5. An R1234ze(E) loop heat pipe with flat-plate evaporator for cooling electronic devices;Zhao;Therm. Sci. Eng. Prog.,2023

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