Effect of PCM-filled hallow fin heat sink for cooling of electronic components — a numerical approach for thermal management perspective

Abstract

This paper aims at the PCM-based heat sink for electronic cooling. In the present analysis, paraffin wax-based phase change material (PCM), in 3-fin and 4-fin hollow heat sinks with the proper volume of PCM in the temperature of the electronic components can be controlled. The PCM-filled heat sinks are placed on top of the high heat-generating integrated circuit (IC) components. The aim is to reduce the maximum temperature of the electronic components and keep them below their critical temperature, hence increasing the life of the IC chips. A correlation is put forward for dimensionless temperature ([Formula: see text]) in terms of heat flux ([Formula: see text]), volume content ([Formula: see text]) and size of the IC chips ([Formula: see text]). It has been found that there will be a 4–[Formula: see text]C drop in temperature when compared to solid fins heat sinks. It is confirmed that the temperature of the IC chip is a strong function of heat flux, size and volume content of PCM.