Experimental study of boiling phenomena and heat transfer performances of FC-72 over micro-pin-finned silicon chips
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s00231-005-0633-x.pdf
Reference25 articles.
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4. Anderson TM, Mudawar I (1989) Microelectronic cooling by enhanced pool boiling of a dielectric fluorocarbon liquid. ASME J Heat Transfer 111:752–759
5. Chowdhury SKR, Winterton RHS (1985) Surface effects in pool boiling. Int J Heat Mass Transfer 28:1881–1889
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