Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy-Reference-Cited by-同舟云学术

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Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy

Published:1989-03 Issue:2 Volume:18 Page:327-337
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Matljasevic Goran,Lee Chin C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02657425.pdf

Reference27 articles.

1. D. R. Olsen and H. M. Berg, “Properties of die bond alloys relating to thermal fatigue,“ Proc. 27th Electron. Components Conf.,27, 193 (1977).

2. D. R. Olsen and H. M. Berg, IEEE Trans. Components, Hybrids, and Manufacturing Tech.CHMT-2 257(1979).

3. G. S. Selvaduray, Thin Solid Films153, 431 (1987).

4. W. D. Bascom and J. L. Bitner, Solid State Technology18, 37 (1975).

5. S. K. Kong, D. L. Feucht, and R. W. Heckel, Microstructural Sci.3, 511 (1975).

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