Author:
Lee Chin C.,Sha Chu-Hsuan,Wu Yuan-Yun,Hsu Shou-Jen
Publisher
Springer International Publishing
Reference82 articles.
1. Luo S, Wong C (2001) Fundamental study on moisture absorption in epoxy for electronic application. In: International symposium on advanced packaging materials, pp 293–298
2. Teh P, Mariatti M, Beh K et al (2007) The properties of epoxy resin coated silica fillers composites. Mater Lett 61:2156–2158
3. Chiu C, Lin J, Hsu K et al. (2003) Thermally cleavable epoxy resins for electronic and optoelectronic applications. In: IEEE Electronics packaging technology conference, pp 425–428
4. Cognard P (ed) (2005) Adhesives and sealants: basic concepts and high tech bonding. Elsevier, Oxford
5. Watanabe T, Ooba N, Imamura S et al (1998) Polymeric optical waveguide circuits formed using silicone resin. J Lightwave Technol 16:1049–1055
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