Separation of silicon wafers by the smart-cut method
Author:
Affiliation:
1. CEA/LETI- Département de Microtechnologies, 17 rue des Martyrs, 38054 Grenoble Cedex, France Fax:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1007/s100190050119
Reference16 articles.
1. Colinge JP (ed) Silicon on insulator technology-materials to VLSI, 2nd edn. Kluwer Academic Publishers, Boston
2. Application of hydrogen ion beams to Silicon On Insulator material technology
3. Plasma Contamination and Wall Erosion in Thermonuclear Reactors
4. An interbubble fracture mechanism of blister formation on helium-irradiated metals
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