Stress measurement by copper electroplating aided by a personal computer
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF02319464.pdf
Reference8 articles.
1. Kato, A., “Relation Between the Density of Grown Grains in Copper Plating and Cyclic Stress,” (in Japanese),J. Soc. Mat. Sci.,30 (332),478–482 (1981).
2. Kato, A., “Stress Concentration Factors of Grooved Shafts in Torsion,”J. Strain Analysis,20 (3),173–177 (1985).
3. Okubo, H., “Determination of the Surface Stress by Means of Electroplating,”J. Appl. Phys.,24 (9),1130–1133 (1953).
4. Okubo, H. andSato, S., “Stress-Concentration Factors in Shafts With Transverse Holes as Found by the Electroplating Method,”J. Appl. Mech.,22 (2),193–196 (1955).
5. Nishitani, H. andHashimoto, K., “Stress Concentration Factors for the Torsion of Shafts with a Circumferential Semi-elliptic Groove,” (in Japanese)Trans. Jap. Soc. Mech. Eng.,43 (374),3642–3650 (1977).
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