Effect of Ambient Temperature on Stress Measurement Method Using Copper Foil
Author:
Affiliation:
1. Department of Mechanical and Aerospace Engineering; Tottori University; 4-101, Koyama-cho Minami, Tottori-shi Tottori 680-8552 Japan
2. Department of Material Science; Shimane University; 1060, Nishikawatsu, Matue-shi Shimane 690-8504 Japan
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/str.12092/fullpdf
Reference12 articles.
1. Copper electroplating method of stress analysis;Ohkubo;Memoirs Fac. Eng. Nagoya Univ.,1968
2. Stress concentration factors of grooved shafts in torsion;Kato;J. Strain Analysis,1985
3. Stress measurement by copper electroplating aided by a personal computer;Kato;Exp. Mech.,1987
4. Fatigue gauge utilizing slip-initiation phenomenon in electroplated copper foil;Nagase;Exp. Mech.,1993
5. Stress measurement by copper electroplating based on grain growth;Kato;Exp. Mech.,1995
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