Cyclic Stress Measurement Using XRD Analysis of Grains Grown in Electrodeposited Copper Foil
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
https://link.springer.com/content/pdf/10.1007/s11340-023-00991-6.pdf
Reference16 articles.
1. Ohkubo H (1968) Copper electroplating method of stress analysis. Memoirs Fac Eng Nagoya Univ 29–1:1
2. Kato A, Mizuno T (1985) Stress concentration factors of grooved shafts in torsion. J Strain Analysis 20–3:173–177
3. Kato A (1987) Stress measurement by copper electroplating aided by a personal computer. Exp Mech 27–2:132–137
4. Nagase Y, Yoshizaki T (1993) Fatigue gauge utilizing slip-initiation phenomenon in electroplated copper foil. Exp Mech 33–1:49–54
5. Kato A (1995) Stress measurement by copper electroplating based on grain growth. Exp Mech 35–1:24–30
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