1. R.R. Tummala, E.J. Rymaszeski, and A.G. Klopfenstein, Microelectronics Packaging Handbook-Part 2 (New York: Chapman & Hall, 1997), pp. 128–283.
2. E. Zakel and H. Reichl, Flip Chip Technology, ed. J. Lau (New York: McGraw-Hill, 1996), pp. 415–490.
3. G.O. Mallory and J.B. Hajdu, Electroless Plating Fundamentals & Applications (Orlando, FL: American Electroplaters & Surface Finishers Society, 1990), chs. 1 and 4, pp. 1–57 and 111–139.
4. E. Jung, P. Kasulke, R. Giebler, J. Kloeser, L. Dietrich, A. Ostmann, E. Zakel, and H. Reichl, Int. J. Microcircuits Electron. Packaging 20, 4 (1997).
5. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).