Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs-Reference-Cited by-同舟云学术

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Published:2018-09-24 Issue:12 Volume:47 Page:7544-7557
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yao Mingjun,Zhao Ning^ORCID,Wang Teng,Yu Daquan,Xiao Zhiyi,Ma Haitao

Funder

National Natural Science Foundation of China

Dalian High-level Talents Innovation Support Program

Fundamental Research Funds for the Central Universities

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-018-6701-z/fulltext.html

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