1. D. Suryanarayana, R. Hsiao, T.P. Gall, and J.M. McCreary, IEEE Trans. CHMT 14, 218 (1991).
2. Y. Tsukada, Y. Mashimoto, T. Nishio, and N. Mii, Proc. 1st ASME/JSME Advances in Electronic Packaging Conf. (New York: ASME, 1992), pp. 827–835.
3. Y. Guo, W.T. Chen, and K.C. Lim, Proc. 1st ASME/JSME Advances in Electronic Packaging Conf. (1992), pp. 779–784.
4. J.H. Lau, T. Krulevitch, W. Schar, M. Heydinger, S. Erasmus, and J. Gleason, Circuit World 19, 18 (1993).
5. C.P. Wong, J.M. Segelken, and C.N. Robinson, in Chip on Board Technologies for Multi-Chip Modules, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1994), pp. 470–503.