Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films-Reference-Cited by-同舟云学术

Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

Published:2003-10 Issue:10 Volume:32 Page:1028-1033
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Sikder A. K.,Kumar Ashok,Shukla P.,Zantye P. B.,Sanganaria M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0085-3.pdf

Reference22 articles.

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4. K.P. Rodbell, E.G. Colgan, and C.K. Hu, Proc. Advanced Metallization for Devices and Circuits—Science, Technology, and Manufacturability (Pittsburgh, PA: Materials Research Society, 1994), pp. 59–70.

5. S. Lagrange, S.H. Brongersma, M. Judelewicz, A. Saerens, I. Vervoort, E. Richard, R. Palmans, and K. Maex, Microelectron. Eng. 50, 449 (2000).

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