Author:
Mes-adi H.,Saadouni K.,Badawi M.,Mazroui M.,Lebègue S.
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference59 articles.
1. Copper: Emerging material for wire bond assembly;Ellis;Solid State Technol.,2000
2. Multilevel interconnections for ULSI and GSI era;Murarka;Mater. Sci. Eng. R Rep.,1997
3. Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications;Hasan;J. Electrochem. Soc.,2010
4. of Book: Handbook of Thin Film Process Technology;Jacobi,2001
5. D.M. Mattox, Handbook of Physical Vapor Deposition (PVD) Processing, William Andrew, 2010.
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献