Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system-Reference-Cited by-同舟云学术

Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system

Published:2005-08 Issue:8 Volume:34 Page:1135-1142
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chang Cheng-An,Chen Sinn-Wen,Chiu Chen-Nan,Huang Yu-Chih

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0242-y.pdf

Reference10 articles.

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2. “Lead-free Assembly Projects,” National Electronics Manufacturing Initiatives (NEMI), http://www.nemi.org/projects/ese/lf_assembly.html, 1999.

3. “Roadmap 2002 for Commercialization of Lead-Free Solder,” Lead-Free Soldering Roadmap Committee, Technical Standardization Committee on Electronics Assembly Technology, Japan Electronics and Information Technology Industries Association (JEITA), 2002.

4. K.N. Tu and K. Zeng, Mater. Sci. Eng. R34, 1 (2001).

5. C.-H. Lin, S.-W. Chen, and C.-H. Wang, J. Electron. Mater. 31, 907 (2002).

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